JohnsonMiller , 03-26-2022, 03:56 AM
In my design with 0.4mm BGA, I have set solder mak opening as 0.0, which means the opening is the same as the PAD or no air-gap; now the manufacturer is asking for more air-gap and asks for solder mak opening bigger than the PAD! It looks like my original thought that the same opening as the PAD will help was wrong, now wondering what is the technical reason for the bigger opening?