mairomaster , 05-26-2016, 05:23 PM
Yes, you can use a big polygon on the bottom layer and use as many stitching ground vias as you can. I am not really convinced about the idea with the aluminium. I don't really think it will increase the heat dissipation, copper is better conductor, hence dissipates better. Maybe you can think of mounting a big heat sink on the bottom layer instead, or probably better, on the heat dissipation devices directly.
If you really want to go with the idea about the aluminium, you need to speak to your PCB manufacturer and understand if it's possible.