robertferanec , 12-28-2018, 04:17 AM
Depends where it is placed and how it is done. For example, if not done properly, solder can flow out through the VIA (you may want to fill up the VIAs), or if not flat enough, soldering BGA can be problem ... it can also cause air trap and air can expand during soldering and can cause a weak or bad soldering (at least that is what I heard). But I do not use VIAs in pad much - we used it only once under BGA and had problems with soldering, so I do not really use it much.