Hello guys.
I am working on a project where I have a commonly used stackup for 4-layers PCB(1.6mm thickness):
L1 - signal
----- PREPREG ----
L2 - Power
----- CORE -----
L3 - GND/GNDA
----- PREPREG ----
L4 - signal
Just to know, I have an analog and digital grounds separated and the analog and digital circuits are connected through an optocoupler (I know this is a whole new topic, let's talk about this later)
I see some problems in this stackup that will for sure cause EMI problems. I'm willing to solve one in special: For example, the signals in L1 doesn't have a proper return path because GND is way too far from the signals on L1 and since the return path will run through the least impedance path, in this case, the Power Plane will be the chosen one.
To solve this without changing this stackup too much I did the following:
L1 - signal/GND/GNDA
----- PREPREG ----
L2 - Power
----- CORE -----
L3 - GND/GNDA
----- PREPREG ----
L4 - signal/GND/GNDA
By doing this I have the electromagnetic fields contained because now I have less inductance in the PCB due power and Gnd on layers L1 and L2. But now 2 questions come up:
1. The return path for the signals on L1 will be the pour GND on L1 or still will be on L3?
2. Because I have GND/GNDA on layer L3 and L4 am I creating some kind of ground loops?
In this video:
https://www.youtube.com/watch?v=5jlvRhXLVls @robertferanec talked about ground loops and I thought I understood well but turns out I didn't. I understand the concept but when applied on PCB I have a lot of doubts.
Can anyone help me with that?
Ps: The images show the layers of my PCB.