IPC 4761 Via Type 7 Question
return0 , 02-02-2024, 01:32 PM
I need to add thermal vias to my design. So I chose IPC 4761 Type 7 from the properties menu for each via that I added under the IC pad. These vias have filling and capping, but when I go to the 3D view of the PCB I can see right thru them. Is this a glitch of the 3D view or am I missing another configuration? I'm afraid that if I send the board to the manufacturer like this it might overheat.
QDrives , 02-02-2024, 04:57 PM
I get the same in 3D. But I have no experience with this.Better add a note in the production data that you have these via types.Is the hole to hole clearance enough? They seem very close together.
return0 , 02-02-2024, 07:24 PM
yeah, the hole sizes are wrong, they should be 0.3mm and I used 0.5mm
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