FEDEVEL
Platform forum

zhenning , 04-10-2016, 12:01 AM

For the schematic, by splitting the components by value, it saves time when generating the BOM. How about the footprint? Say if its 0805, then, the footprint can be for a resistor or a capacitor or even inductor etc. If not i see that when i added the 3D body, the model appears the same across all the different components

mairomaster , 04-10-2016, 05:14 AM

Hi zhenning,

I don't quite understand what you mean by splitting. With the footprints, in my libraries I am using different footprints for resistors, capacitors and inductors, even if they all are 0805 lets say. The first reason is that the different component packages could have slightly different specifications and hence requiring slightly different footprints. That is specified by the IPC-7351 footprints standard as well. Here is an example of 3 IPC footprints:

RESC1005N (Nominal size 0402 (1005 metric) chip resistor)
CAPC1005N (Nominal size 0402 (1005 metric) chip capacitor)
INDC1005N (Nominal size 0402 (1005 metric) chip inductor)

Apart from the land pattern of the footprint it might be convenient to also use differently coloured 3D bodies for example, in order to be obvious what is what in the 3D view.

zhenning , 04-10-2016, 05:21 AM

That answers it. Thanks.

robertferanec , 04-10-2016, 12:35 PM

We also use R0805, C0805, .....