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Filled vias in footprint for feedthrough capacitor
Kalaslas , 09-02-2025, 11:55 AM
I'm looking at the NFM21HC223R1H3D feedthrough capacitor (https://search.murata.co.jp/Ceramy/image/img/A01X/G101/ENG/NFM21HC223R1H3-01.pdf) , and the recommended land pattern seems to recommend filled vias in the footprint, does anyone here understand why? And what if I would skip them to keep the footprint simple?
QDrives , 09-02-2025, 02:34 PM
No, the NFM21HC does not use filled vias. The vias are not in the pads.
Kalaslas , 09-02-2025, 02:37 PM
Ok, true they are not in the pad for the 21HC, they are just indicated as thru holes, outside the pads. Still don't understand the purpose though? And the 15HC for example has filled vias in the pads?
QDrives , 09-02-2025, 08:11 PM
The capacitor only works if there is a good Gnd connection to begin with.Hence the many vias. Altough I might place 2 vias on the sides of the center pads. So 5 in total.
Kalaslas , 09-03-2025, 07:03 AM
Ah, makes sense! So its not related to any physical/geometrical reason then, it is only required for the electrical function of the capacitor, if I understand correctly?
QDrives , 09-03-2025, 01:50 PM
The vias are there for the filter to work reliably / correct.
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